Hello
I have just finished reading the EE- 352 Engineering note regarding E-pad packages and mounting techniques. One thing I am not clear of is you don't say whether or not you use thermal relief's or direct connects on the ground plane connecting via's. Obviously direct connection would give you better electrical connection and lower thermal resistance to the ground plane but would it alter the temperature profile needed for reflow ? ie which would be better from the point of view of manufacturability ?
regards
david